Dr. Senad Bulja, PhD, FIET, SMIEEE

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Apparatus for radio frequency signals and method of manufacturing such apparatus

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Publication number: 20200313265
Type: Application
Filed: Mar 19, 2020
Publication Date: Oct 1, 2020
Patent Grant number: 11276907
Inventors: Florian Pivit (Dublin), Senad Bulja (Dublin)
Application Number: 16/823,395

Abstract:  In this invention single and multi-layered PCB distributed resonators and filters implemented in PCB technology are presented.  Fig. 1 depicts how such resonators can be implemented. Distributed resonators and filters have been previously introduced by the author as the means of profile reduction.

Figure 1 Multi-layer PCB implementation (a) and single layer implementation (b) (vertical cross-section through the layer stack), thick black lines representing metalization resp. plating with conductive metal, thin lines representing PCB-layer boundaries)
Figure 1 Multi-layer PCB implementation (a) and single layer implementation (b) (vertical cross-section through the layer stack), thick black lines representing metalization resp. plating with conductive metal, thin lines representing PCB-layer boundaries)

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